English to German Tech/Engineering Electronics / Elect Eng

A number of techniques are known for producing electronic interconnect vias in MCM-D structures. According to one process, a dielectric material, generally ceramic or silicon coated with silicon dioxide, is provided as a base. Conductors are formed on the base beneath the dielectric material. A hole is formed in the dielectric material, which is then **sputtered and pattern plated** with a metal, such as copper, to interconnect the lower level of conductor 42 with a formed upper level 42.