wedge bond

Polish translation: połączenie klinowe

04:49 Jan 21, 2021
English to Polish translations [PRO]
Tech/Engineering - Engineering (general)
English term or phrase: wedge bond
Rodzaj połączenia lutowanego w układzie scalonym. Fragment pochodzi z tekstu dotyczącego przemysowego aparatu rentgenowskiego.

Specify the wire end points
Once the new chip setup has been created, the first thing that needs to be done is to specify the start and end points of the bond wires. It is important that the start point is defined on the ball bond and that the end point is defined as the wedge bond of each wire. This ensures the best quality analysis of the bond wires.
Tomasz Rylek
Poland
Local time: 13:37
Polish translation:połączenie klinowe
Explanation:
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Note added at 6 hrs (2021-01-21 11:29:41 GMT)
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Jakiego rodzaju połączenia (kulkowe ang. ball bond, klinowe wedge bond) występują w efekcie zgrzewania termokompresyjngo

- https://t.ly/9T2b
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geopiet
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Summary of answers provided
2połączenie klinowe
geopiet
Summary of reference entries provided
wedge bonding
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Answers


6 hrs   confidence: Answerer confidence 2/5Answerer confidence 2/5
połączenie klinowe


Explanation:
.

--------------------------------------------------
Note added at 6 hrs (2021-01-21 11:29:41 GMT)
--------------------------------------------------

Jakiego rodzaju połączenia (kulkowe ang. ball bond, klinowe wedge bond) występują w efekcie zgrzewania termokompresyjngo

- https://t.ly/9T2b

geopiet
Native speaker of: Native in PolishPolish
PRO pts in category: 398
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Reference comments


6 hrs
Reference: wedge bonding

Reference information:
The wedge bonding process, on the other hand, utilizes ultrasonic energy and pressuredescribe the image to create a bond between the wire and the bond pad. When gold wire is used, wedge bonding uses temperatures up to 150 degrees C, and similar to ball bonding this technique is called thermosonic (T/S) bonding. The most predominant process for wedge bonding is a low temperature process or ambient temperature bonding, where aluminum wire is used to make the interconnection of the die and package. This “welding process” (either hot or cold) deforms the wire into a flat elongated shape of a wedge, however depending on the type of wedge tool used, the shape can sometimes have a cross groove (typically for 1 mil gold wire). Unlike ball bonding, the first bond for a wedge bond does not have a ball, which is why this wire bonding process is called wedge-wedge bonding.

- https://www.palomartechnologies.com/blog/bid/206846/ball-bon...

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Note added at 6 hrs (2021-01-21 11:20:32 GMT)
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Wedge bonding utilizes a wedge tool to form the stitches on both ends, without the use of a ball for the first bond - https://www.palomartechnologies.com/processes/wire-bonding/w...

geopiet
Native speaker of: Native in PolishPolish
PRO pts in category: 398
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